Semicon Microcontroller Voltage regulator IC Chips TPS62420DRCR SON10 Electronic Components BOM mndandanda utumiki

Lingaliro lapaketi:

Njira yopapatiza: Njira yokonzera, kuyika, ndi kulumikiza tchipisi ndi zinthu zina pa chimango kapena gawo lapansi pogwiritsa ntchito ukadaulo wamafilimu ndi njira zopangira ma microfabrication, zomwe zimatsogolera ku ma terminals ndikuwakonza powaphika ndi sing'anga yotsekereza kuti apange mawonekedwe azithunzi zitatu.

Mwachidule: njira yolumikizira ndi kukonza phukusi ku gawo lapansi, kusonkhanitsa mu dongosolo lathunthu kapena chipangizo chamagetsi, ndikuwonetsetsa kuti dongosolo lonse likuyenda bwino.

Ntchito zopezedwa ndi chip phukusi.

1. kusamutsa ntchito;2. kutumiza zizindikiro za dera;3. kupereka njira yochepetsera kutentha;4. chitetezo ndi chithandizo cha zomangamanga.

Mlingo waukadaulo wamakina opanga ma CD.

Kuyika makina kumayambira chip cha IC chikapangidwa ndipo chimaphatikizapo njira zonse zisanayambe chip IC chip ndi kukhazikitsidwa, kulumikizidwa, kutsekedwa, kusindikizidwa ndi kutetezedwa, kulumikizidwa ku bolodi la dera, ndipo dongosololi likusonkhanitsidwa mpaka chomaliza chatsirizidwa.

Mulingo woyamba: womwe umadziwikanso kuti chip level packaging, ndi njira yokonza, kulumikiza, ndikuteteza chip IC ku gawo lapansi kapena chimango chotsogolera, ndikupangitsa kukhala gawo (msonkhano) chigawo chomwe chitha kunyamulidwa ndikusamutsidwa ndikulumikizidwa. ku mulingo wotsatira wa msonkhano.

Mzere wa 2: Njira yophatikizira mapaketi angapo kuchokera pamlingo 1 ndi zida zina zamagetsi kuti apange khadi yozungulira.Gawo 3: Njira yophatikizira makhadi angapo ozungulira omwe amasonkhanitsidwa kuchokera pamaphukusi omalizidwa pamlingo wa 2 kuti apange gawo kapena kachitidwe kakang'ono pa bolodi lalikulu.

Gawo 4: Njira yophatikizira ma subsystem angapo kukhala chinthu chonse chamagetsi.

Mu chip.Njira yolumikizira magawo ophatikizika amagetsi pa chip imadziwikanso kuti kuyika kwa zero-level, kotero uinjiniya wazolongedza ungasiyanitsidwenso ndi magawo asanu.

Gulu la paketi:

1, malinga ndi kuchuluka kwa tchipisi ta IC mu phukusi: phukusi limodzi la chip (SCP) ndi phukusi lamitundu yambiri (MCP).

2, molingana ndi kusindikiza zakuthupi: zida za polima (pulasitiki) ndi zoumba.

3, molingana ndi chipangizo ndi njira yolumikizira bolodi yolumikizira: mtundu woyikapo pini (PTH) ndi mtundu wamtundu wamtunda (SMT) 4, malinga ndi mawonekedwe amtundu wa pini: zikhomo zambali imodzi, zikhomo zambali ziwiri, zikhomo zambali zinayi, ndi zikhomo zapansi.

Zipangizo za SMT zili ndi zikhomo zachitsulo zamtundu wa L, mtundu wa J, ndi mtundu wa I.

SIP: phukusi lamzere umodzi SQP: phukusi laling'ono la MCP: phukusi lachitsulo DIP: phukusi la mizere iwiri CSP: phukusi la kukula kwa chipangizo