IC XCKU025-1FFVA1156I Chip Integrated Circuit IC FPGA 312 I/O 1156FCBGA

Kufotokozera mwachidule:

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA、FCBGA

Tsatanetsatane wa Zamalonda

Zogulitsa Tags

Makhalidwe a Zamalonda

TYPE	CHITSANZO
gulu	Magawo Ophatikizana (ICs) Zophatikizidwa Field Programmable Gate Arrays (FPGAs)
wopanga	AMD
mndandanda	Kintex® UltraScale™
kulunga	zambiri
Mkhalidwe wa malonda	Yogwira
DigiKey ndi yotheka	Sizinatsimikizidwe
Nambala ya LAB/CLB	18180
Chiwerengero cha logic zinthu/mayunitsi	318150
Chiwerengero chonse cha ma bits a RAM	13004800
Nambala ya I/Os	312
Voltage - Mphamvu yamagetsi	0.922V ~ 0.979V
Mtundu woyika	Pamwamba zomatira mtundu
Kutentha kwa ntchito	-40°C ~ 100°C (TJ)
Phukusi/Nyumba	1156-BBGA,Mtengo wa FCBGA
Wogulitsa chigawo encapsulation	1156-FCBGA (35x35)
Nambala yamalonda yamalonda	XCKU025

Documents & Media

ZOTHANDIZA TYPE	KULUMIKIZANA
Tsamba lazambiri	Kintex® UltraScale™ FPGA Datasheet
Zambiri za chilengedwe	Chitsimikizo cha Xiliinx RoHS Xilinx REACH211 Cert
PCN kapangidwe/matchulidwe	Ultrascale & Virtex Dev Spec Chg 20/Dec/2016

Kugawika kwa chilengedwe ndi zotumiza kunja

ATTRIBUTE	CHITSANZO
Udindo wa RoHS	Mogwirizana ndi malangizo a ROHS3
Mulingo Wokhudzika Wachinyezi (MSL)	4 (maola 72)
REACH status	Osati kutsata ndondomeko ya REACH
Mtengo wa ECCN	3A991D
HTSUS	8542.39.0001

Chiyambi cha Zamalonda

Mtengo wa FCBGA(Flip Chip Ball Grid Array) imayimira "flip chip ball grid Array".

FC-BGA(Flip Chip Ball Grid Array), yomwe imatchedwa flip chip ball grid array package, ndiyenso mtundu wofunikira kwambiri wa tchipisi tazithunzi pakali pano.Ukadaulo woyika izi unayamba m'zaka za m'ma 1960, pomwe IBM idapanga ukadaulo wotchedwa C4 (Controlled Collapse Chip Connection) wophatikiza makompyuta akulu, kenako idapangidwanso kuti igwiritse ntchito kugwedezeka kwapamtunda kwa chophulika chosungunuka kuti chithandizire kulemera kwa chip. ndikuwongolera kutalika kwa chotupacho.Ndikukhala njira yopangira ukadaulo wa flip.

Ubwino wa FC-BGA ndi chiyani?

Choyamba, chimathetsakugwirizana kwa electromagnetic(EMC) ndielectromagnetic interference (EMI)mavuto.Nthawi zambiri, kufalitsa kwa chip kwa chipangizocho pogwiritsa ntchito ukadaulo wapa WireBond kumachitika kudzera pa waya wachitsulo wokhala ndi kutalika kwake.Pankhani ya maulendo apamwamba, njirayi idzatulutsa zomwe zimatchedwa impedance effect, kupanga chopinga panjira ya chizindikiro.Komabe, FC-BGA imagwiritsa ntchito ma pellets m'malo mwa mapini kulumikiza purosesa.Phukusili limagwiritsa ntchito mipira yonse ya 479, koma iliyonse ili ndi mainchesi a 0,78 mm, yomwe imapereka mtunda waufupi kwambiri wolumikizira kunja.Kugwiritsa ntchito phukusili sikumangopereka magwiridwe antchito amagetsi, komanso kumachepetsa kutayika ndi kutsika pakati pa zolumikizira zamagulu, kumachepetsa vuto la kusokonezedwa ndi ma elekitiroma, ndipo kumatha kupirira ma frequency apamwamba, kuswa malire opitilira muyeso kumakhala kotheka.

Chachiwiri, pamene opanga ma chip owonetsera akuyika mabwalo ochulukirapo m'dera lomwelo la silicon crystal, kuchuluka kwa zolowetsa ndi zotulutsa ndi mapini zidzawonjezeka mofulumira, ndipo ubwino wina wa FC-BGA ndikuti ukhoza kuonjezera kachulukidwe ka I/O. .Nthawi zambiri, ma I/O amatsogolera pogwiritsa ntchito ukadaulo wa WireBond amakonzedwa mozungulira chip, koma pambuyo pa phukusi la FC-BGA, mayendedwe a I/O amatha kukonzedwa molingana ndi chip, kupereka kachulukidwe kapamwamba I/O. kamangidwe kake, zomwe zimapangitsa kugwiritsa ntchito bwino, komanso chifukwa cha mwayiwu.Tekinoloje ya inversion imachepetsa deralo ndi 30% mpaka 60% poyerekeza ndi mafomu achikhalidwe.

Potsirizira pake, mumbadwo watsopano wa tchipisi tating'onoting'ono tating'ono tating'ono tating'ono tating'ono tating'ono tambiri, vuto la kutulutsa kutentha lidzakhala vuto lalikulu.Kutengera mawonekedwe apadera a phukusi la FC-BGA, kumbuyo kwa chip kumatha kuwululidwa ndi mpweya ndipo kumatha kutulutsa kutentha mwachindunji.Pa nthawi yomweyi, gawo lapansili lingathenso kupititsa patsogolo kutentha kwa kutentha kupyolera muzitsulo zachitsulo, kapena kukhazikitsa sinki yotentha yachitsulo kumbuyo kwa chip, kulimbitsa mphamvu ya kutentha kwa chip, ndikusintha kwambiri kukhazikika kwa chip. pa ntchito yothamanga kwambiri.

Chifukwa cha zabwino za phukusi la FC-BGA, pafupifupi tchipisi tamakhadi onse othamangitsa zithunzi amapangidwa ndi FC-BGA.

Zam'mbuyo: XC7VX485T-2FFG1761I Virtex®-7 T ndi XT FPGAs akupezeka mu -3, -2, -1, ndi -2L liwiro giredi RoHS Compliant

Ena: XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104

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