Electronic ic chip Support BOM Service TPS54560BDDAR zida zatsopano zamagetsi zamagetsi

1.Kutchula mayina a IC, chidziwitso chambiri ndi malamulo a mayina:

Kutentha kosiyanasiyana.

C=0°C mpaka 60°C (giredi yamalonda);I=-20°C mpaka 85°C (giredi la mafakitale);E=-40°C mpaka 85°C (kuchuluka kwa mafakitale);A=-40°C mpaka 82°C (kalasi yazamlengalenga);M=-55°C mpaka 125°C (kalasi ya usilikali)

Mtundu wa paketi.

A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic mkuwa pamwamba;E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-Yopapatiza DIP;N-DIP;Q PLCC;R - Narrow Ceramic DIP (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Wide Small Form Factor (300mil) W-Wide mawonekedwe ang'onoang'ono (300 mil);X-SC-60 (3P, 5P, 6P);Y-Yopapatiza mkuwa pamwamba;Z-TO-92, MQUAD;D-Die;/ PR-Kulimbitsa pulasitiki;/W-Wafer.

Nambala ya mapini:

a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;ine -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;Nd 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (kuzungulira);W-10 (kuzungulira);X-36;Y-8 (yozungulira);Z-10 (zozungulira).(kuzungulira).

Zindikirani: Chilembo choyamba cha zilembo zinayi zamagulu a mawonekedwe ndi E, zomwe zikutanthauza kuti chipangizocho chili ndi ntchito yotsutsa.

2.Kupititsa patsogolo luso lazonyamula

Mabwalo oyambilira ophatikizika adagwiritsa ntchito mapaketi apulasitiki a ceramic, omwe adapitilizabe kugwiritsidwa ntchito ndi asitikali kwazaka zambiri chifukwa chodalirika komanso kukula kwake kochepa.Kuyika kwa malonda posakhalitsa kunasinthira kukhala mapaketi apamizere apawiri, kuyambira ndi ceramic kenako pulasitiki, ndipo m'zaka za m'ma 1980 kuchuluka kwa mapini a mabwalo a VLSI kudapitilira malire ogwiritsira ntchito mapaketi a DIP, zomwe zidapangitsa kuti pakhale ma pin grid array ndi zonyamulira chip.

Phukusi lokwera pamwamba lidawonekera kumayambiriro kwa zaka za m'ma 1980 ndipo lidakhala lodziwika kumapeto kwa zaka khumi zimenezo.Imagwiritsa ntchito pini yabwino kwambiri ndipo imakhala ndi mapiko owoneka ngati J.Small-Outline Integrated Circuit (SOIC), mwachitsanzo, ili ndi malo ochepera 30-50% ndipo ndi 70% yocheperako kuposa DIP yofanana.Phukusili lili ndi zikhomo zooneka ngati gull zotuluka mbali ziwiri zazitali ndi pini ya 0.05".

Small-Outline Integrated Circuit (SOIC) ndi PLCC phukusi.m'zaka za m'ma 1990, ngakhale phukusi la PGA linkagwiritsidwabe ntchito ngati ma microprocessors apamwamba kwambiri.PQFP ndi phukusi laling'ono laling'ono (TSOP) linakhala phukusi lanthawi zonse la zida zowerengera mapini apamwamba.Ma microprocessors apamwamba a Intel ndi AMD adasuntha kuchoka pa PGA (Pine Grid Array) kupita ku Land Grid Array (LGA) phukusi.

Maphukusi a Ball Grid Array anayamba kuonekera m'ma 1970, ndipo m'zaka za m'ma 1990 phukusi la FCBGA linapangidwa ndi mapini apamwamba kuposa mapepala ena.Mu phukusi la FCBGA, fayiyo imatembenuzidwira mmwamba ndi pansi ndikugwirizanitsa ndi mipira ya solder pa phukusi ndi PCB-ngati m'munsi wosanjikiza osati mawaya.Mumsika wamakono, ma CD ndi gawo losiyana la ndondomekoyi, ndipo teknoloji ya phukusi ingakhudzenso ubwino ndi zokolola za mankhwala.