dongosolo_bg

mankhwala

Zatsopano zatsopano za IC stock Electronic Components Ic Chip Support BOM Service TPS22965TDSGRQ1

Kufotokozera mwachidule:


Tsatanetsatane wa Zamalonda

Zogulitsa Tags

Makhalidwe a Zamalonda

TYPE DESCRIPTION
Gulu Magawo Ophatikizana (ICs)

Power Management (PMIC)

Kusintha kwa Magetsi, Madalaivala Onyamula

Mfr Texas Instruments
Mndandanda Magalimoto, AEC-Q100
Phukusi Tape & Reel (TR)

Dulani Tepi (CT)

Digi-Reel®

Mkhalidwe wa Zamalonda Yogwira
Sinthani Mtundu General Cholinga
Chiwerengero cha Zotuluka 1
Chiyerekezo - Zolowetsa:Zotuluka 1:1
Kukonzekera kwa Zotulutsa Mbali Yapamwamba
Mtundu Wotulutsa N-Channel
Chiyankhulo Yatsani/Kuzimitsa
Voltage - Katundu 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd) 0.8V ~ 5.5V
Zapano - Zotulutsa (Zambiri) 4A
Rds On (Typ) 16 mkhm
Mtundu Wolowetsa Osasintha
Mawonekedwe Kutulutsa Katundu, Kuwotcha Kuwongoleredwa
Chitetezo cha Mphamvu -
Kutentha kwa Ntchito -40°C ~ 105°C (TA)
Mtundu Wokwera Surface Mount
Phukusi la chipangizo cha Supplier 8-WSON (2x2)
Phukusi / Mlandu 8-WFDFN Yowonekera Pad
Nambala Yoyambira Yogulitsa Chithunzi cha TPS22965

 

Kupaka ndi chiyani

Pambuyo pa njira yayitali, kuchokera pakupanga mpaka kupanga, mumapeza chip IC.Komabe, chip ndi chaching’ono komanso chowonda kwambiri moti chimatha kukanda ndi kuwonongeka mosavuta ngati sichitetezedwa.Komanso, chifukwa cha kukula kwa chip, sikophweka kuziyika pa bolodi pamanja popanda nyumba yaikulu.

Choncho, kufotokoza kwa phukusi kumatsatira.

Pali mitundu iwiri yamaphukusi, phukusi la DIP, lomwe nthawi zambiri limapezeka muzoseweretsa zamagetsi ndipo limawoneka ngati centipede yakuda, ndi phukusi la BGA, lomwe limapezeka nthawi zambiri pogula CPU m'bokosi.Njira zina zoyikamo zikuphatikizapo PGA (Pin Grid Array; Pin Grid Array) yomwe imagwiritsidwa ntchito m'ma CPU oyambirira kapena DIP yosinthidwa, QFP (pulasitiki square flat phukusi).

Chifukwa pali njira zambiri zopangira ma CD, zotsatirazi zikufotokozera phukusi la DIP ndi BGA.

Phukusi lachikhalidwe lomwe lakhalapo kwa zaka zambiri

Phukusi loyamba lodziwika ndi Dual Inline Package (DIP).Monga mukuwonera pachithunzi pansipa, IC chip mu phukusili ikuwoneka ngati centipede yakuda pansi pamizere iwiri ya zikhomo, zomwe ndi zochititsa chidwi.Komabe, chifukwa chakuti nthawi zambiri amapangidwa ndi pulasitiki, kutentha kwa kutentha kumakhala kosauka ndipo sikungathe kukwaniritsa zofunikira za tchipisi tamakono tothamanga kwambiri.Pazifukwa izi, ma IC ambiri omwe amagwiritsidwa ntchito mu phukusili ndi tchipisi tokhalitsa, monga OP741 pazithunzi pansipa, kapena ma IC omwe safuna kuthamanga kwambiri komanso amakhala ndi tchipisi tating'ono tokhala ndi ma vias ochepa.

Chip cha IC kumanzere ndi OP741, amplifier wamba wamba.

IC kumanzere ndi OP741, amplifier wamba wamagetsi.

Ponena za phukusi la Ball Grid Array (BGA), ndi laling'ono kuposa phukusi la DIP ndipo limatha kulowa muzipangizo zing'onozing'ono.Kuphatikiza apo, chifukwa zikhomo zili pansi pa chip, zikhomo zambiri zachitsulo zimatha kukhazikitsidwa poyerekeza ndi DIP.Izi zimapangitsa kuti ikhale yabwino kwa tchipisi chomwe chimafuna olumikizana nawo ambiri.Komabe, ndi okwera mtengo komanso njira yolumikizirana ndiyovuta kwambiri, motero imagwiritsidwa ntchito kwambiri pazinthu zotsika mtengo.


  • Zam'mbuyo:
  • Ena:

  • Lembani uthenga wanu apa ndikutumiza kwa ife